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![[Data] Plasma dicing of various materials](https://image.mono.ipros.com/public/product/image/47c/2000499782/IPROS50645552467826755000.png?w=280&h=280)
It includes a comparison of blade dicing and plasma dicing.
This document introduces plasma dicing of a wide variety of materials. It includes the advantages of plasma dicing and Samco's technology. Please take a moment to read it. 【Contents】 ■ Advantages of plasma dicing ■ Samco's technology ■ Processing of a wide variety of materials is possible ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.
Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
The "MDS-100/MDS-300" is a plasma dicing device that utilizes inductively coupled technology, enabling stable and uniform continuous processing of 25 wafers with high-output plasma. It allows processing while maintaining high uniformity without causing damage to the wafers, similar to that caused by saws or lasers. Using the Bosch process with a high-speed gas switching system, it achieves excellent sidewall shape and processing of free shapes, providing superior dicing strength compared to existing methods. 【Features】 ■ Contributes to improved die quality, yield, and freedom of die shape with excellent processing capability ■ Supports multiple wafer sizes (MDS-100: φ4" to 8", MDS-300: φ8" to 12") ■ Dicing using Bosch process with inductively coupled plasma ■ Achieves fast and stable step switching through a high-speed gas switching system ■ Allows setting of parameter morphing and its fluctuation trends *For more details, please refer to the PDF document or feel free to contact us.
